What is magnetic shield patch inductance pad?
We know that the chip inductors use surface mount technology (SMT), which connects the components to the PCB by soldering. Pad refers to the welding surface between PCB and patch inductance, generally called BASE, pad is a noun used by engineers, and the part of the pad that contacts on the patch inductance is called electrode position.
Magnetic shielding inductance pad is generally composed of tin-coated copper material, and has two conductive surface treatment methods of single-sided mist tin and double-sided mist tin.
Why is magnetic shield patch inductance pad particularly important?
If the surface treatment of the pad in the magnetic shield patch inductor is not detailed enough, the copper surface will be exposed. Once the exposed copper electrode position of the inductance pad is extremely difficult to tin, and the electrical conductivity is poor, it is easy to cause false welding when it is attached to the whole plate, and the inductance of the magnetic shield patch will lose its function.
When the magnetic shield patch inductor is used as the choke, if the welding pad is damaged, it is easy to cause the current of the whole machine to short circuit, and the circuit is burned out in serious cases.
The technology of magnetic shield patch inductance pad directly determines the performance of the product. When purchasing, customers need to consider the production process of the inductor manufacturer.
In addition, the size of the pad determines the package size of the inductor, and the magnetic shield patch inductor of the corresponding size should be selected according to the size of the pad.
For the above reasons, manufacturers warn: magnetic shield patch inductance pad is particularly important!
